SK Hynix to Hold Indiana Packaging Plant Groundbreaking on Aug. 27

SK Hynix will hold a groundbreaking ceremony on Aug. 27 for its advanced semiconductor packaging plant in Indiana. Chief Executive Officer Kwak Noh-jung and other senior executives are set to attend, and the event is drawing interest over whether SK Group Chairman Chey Tae-won will meet again with Nvidia Chief Executive Officer Jensen Huang.

SK Hynix has finalized Aug. 27 for the ceremony at the advanced semiconductor packaging fab it is building in West Lafayette, Indiana, and has sent official invitations to major customers and suppliers, according to industry officials on Aug. 12.

Kwak and other top executives are expected at the event. Industry attention is also focused on the possibility of a meeting between Chey and Huang.

A meeting between the two could offer a clearer picture of additional US semiconductor investment plans. Their companies have maintained close cooperation in AI data centers and in the supply of high-bandwidth memory, or HBM, and graphics processing units.

After SK Group's American depositary receipt listing, Chey told local media that the company could also build a memory production plant if conditions including power, water, labor and supply chains are in place, signaling the possibility of expanding memory production lines in the US.

The investment push has coincided with calls from Washington. US Commerce Secretary Howard Lutnick recently publicly urged South Korean chipmakers to expand production in the US.

SK Hynix is building the advanced packaging plant in West Lafayette with an investment of $3.87 billion.

The company aims to begin full-scale frame construction and start mass production of next-generation AI memory products, including HBM, in the second half of 2028. The US government has also said it will provide up to $450 million in direct subsidies and $500 million in loans under the CHIPS Act.

Noh Jung-dong, Hankyung.com reporter dong2@hankyung.com