Summary
- Reuters reported that SK Hynix and Intel are in talks over memory production in the US.
- Reuters said the companies are discussing a plan for SK Hynix to lease Intel's Ohio semiconductor manufacturing facility and a joint venture involving major cloud companies.
- SK Hynix said it is currently investing $4 billion to build a next-generation HBM packaging facility in Indiana.
Forecast Trend Report by Period
SK Hynix is discussing cooperation with Intel on producing memory semiconductors in the US, in what would mark the South Korean company's first memory chip manufacturing operation in the country.
Reuters reported on September 16, citing multiple sources, that SK Hynix and Intel have recently been in talks on memory production in the US.
SK Hynix told Reuters it is considering various options, including establishing additional production bases, to strengthen the competitiveness of its memory business. Nothing has been decided, the company added.
One option under discussion is for SK Hynix to lease part of Intel's semiconductor manufacturing facility under construction in Ohio, Reuters reported. The news agency also said Intel, SK Hynix and major cloud companies seeking stable memory supplies are discussing the possibility of setting up a joint venture.
The talks are still at an early stage. Even if the companies reach a deal, the products to be made in Ohio have not been determined and could include high-bandwidth memory, DRAM or NAND flash, according to the report.
SK Hynix is currently investing $4 billion to build a next-generation HBM packaging facility in Indiana. The plant is a back-end facility that will assemble DRAM produced in South Korea and elsewhere into HBM.
If cooperation with Intel materializes, it would mark SK Hynix's first front-end memory production operation in the US.
